Printed Circuit and Adhesive Lamination for Microfluidics

Our Client

A multinational global medical device company offering a broad range of innovative medical and scientific devices.

The Challenge

Our client came to us with the following challenges:

  • To manufacture a multi-layer microfluidic component that included a printed electrical circuit laminated with patterned bio-inert adhesive in a tight registration tolerance of ± 0.2 mm
  • To develop this multi-layer microfluidic component to meet strict parameters

Our Solution

  • Our understanding of bio inert adhesives was critical to the user along with our ability to cut, laminate and present the components for down-stream integration onto an injection molded microfluidic chip
  • We developed an innovative and cost effective manufacturing process
  • We used a customer selected Silver/Silver Chloride Ink (Ag/Ag Cl) for specific product testing that achieved the current required to be generated in the circuit
  • Roll-to-roll of presentation carrier becomes final carrier for assembled injection molded body and circuitry
  • Final product seamlessly incorporates into the customer’s automated production line for assembly

The Outcome

  • As a result of the solution we developed, our client can now meet their objective
  • Objective achieved by merging Screen printing and pattern adhesive converting
  • Able to move forward with second generation product, moving it from development to commercialization

 

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Our Client

A multinational global medical device company offering a broad range of innovative medical and scientific devices.

The Challenge

Our client came to us with the following challenges:

  • To manufacture a multi-layer microfluidic component that included a printed electrical circuit laminated with patterned bio-inert adhesive in a tight registration tolerance of ± 0.2 mm
  • To develop this multi-layer microfluidic component to meet strict parameters

Our Solution

  • Our understanding of bio inert adhesives was critical to the user along with our ability to cut, laminate and present the components for down-stream integration onto an injection molded microfluidic chip
  • We developed an innovative and cost effective manufacturing process
  • We used a customer selected Silver/Silver Chloride Ink (Ag/Ag Cl) for specific product testing that achieved the current required to be generated in the circuit
  • Roll-to-roll of presentation carrier becomes final carrier for assembled injection molded body and circuitry
  • Final product seamlessly incorporates into the customer’s automated production line for assembly

The Outcome

  • As a result of the solution we developed, our client can now meet their objective
  • Objective achieved by merging Screen printing and pattern adhesive converting
  • Able to move forward with second generation product, moving it from development to commercialization